Ferroelectric oxide films for energy and memory devices (FOXEM)
Ferroelectric oxide thin films, CMOS-compatible materials and emerging memory devices for energy-efficient electronics and advanced data technologies.
Ferroelectric oxide films for future memory and energy-efficient devices
The Ferroelectric oxide films for energy and memory devices (FOXEM) group develops high-quality new ferroelectric materials compatible with industrial technologies, studying their properties from fundamental understanding to device-level implementation.
The electronics industry faces major bottlenecks in sustaining the growing demand for data storage, computation and communication devices. FOXEM investigates CMOS-compatible HfO2-based ferroelectrics and epitaxial oxide thin films as model systems to understand, optimize and integrate ferroelectric properties.
The group combines thin film growth, structural studies, advanced electrical characterization and prototyping of conventional and emerging memory devices within the ICMAB advanced materials research ecosystem.
Research challenges
FOXEM addresses the materials and device challenges required to make ferroelectric oxide films reliable, scalable and compatible with future energy-efficient electronics.
CMOS-compatible ferroelectrics
Energy-efficient memory
Ultrathin film functionality
From model systems to devices
Main research lines
The group works across complementary research lines spanning ferroelectric oxide development, silicon integration, ultrathin films, reliability and device prototyping.
Development of HfO2-based ferroelectric oxides
Integration of oxides on silicon
Ferroelectricity in ultrathin films
Epitaxial films for ferroelectric understanding
Ferroelectric reliability
Devices for ultrafast computing
Materials, methods and scientific approach
FOXEM research links materials growth, structural analysis and electrical characterization to understand how ferroelectric oxide films can be controlled and integrated into functional devices.
The group studies hafnia-based ferroelectrics, epitaxial oxide films and silicon-compatible integration routes, with an emphasis on scalable materials concepts for next-generation memories and energy-efficient electronics.
Thin film growth
Structural characterization
Electrical properties
Device prototyping
People
Scientific researchers, postdoctoral researchers, PhD students and project researchers associated with the FOXEM research group.
Permanent Scientific Researchers
Postdoctoral Researchers
PhD Students and Project Researchers
Connected to the ICMAB research ecosystem
FOXEM contributes to ICMAB’s research in functional oxides, energy-efficient electronics, advanced thin films and memory devices.
Research Groups
Research Units
Materials for Electronics
Contact and group website
For detailed information about FOXEM research activity, current projects, publications and opportunities, visit the external group website or contact the group through the corresponding ICMAB channels.
Ferroelectric oxide films for energy and memory devices
HfO2-based ferroelectrics, epitaxial oxide thin films, silicon integration, ultrathin film ferroelectricity and emerging memory devices.

